Design of a sideband adapter for a multi-die system in package using die-to-die control

Abstract

This architecture improves performance, optimizes costs, and offers greater manufacturing flexibility compared to traditional monolithic (single chip) designs. In systems with multiple dies, effective coordination requires not only a primary data transfer protocol but also a secondary channel for exchanging control signals, status, and configuration data. This channel is often called a sideband, serving as support and ensuring synchronization among the dies. Designing an appropriate sideband adapter plays a crucial role in ensuring system scalability, reducing communication latency, and optimizing energy consumption. This is especially important for high-bandwidth, low-latency applications such as AI, HPC (High-Performance Computing), telecommunications, and complex embedded systems.