Please use this identifier to cite or link to this item:
http://thuvienso.dut.udn.vn/handle/DUT/7333| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Linh Giang, Nguyen | en_US |
| dc.contributor.author | Quang Bang, Tao | en_US |
| dc.date.accessioned | 2025-08-15T12:18:38Z | - |
| dc.date.available | 2025-08-15T12:18:38Z | - |
| dc.date.issued | 2017 | - |
| dc.identifier.uri | http://thuvienso.dut.udn.vn/handle/DUT/7333 | - |
| dc.language.iso | en | en_US |
| dc.publisher | The University of Danang - University of Science and Technology Dut with Japan University & Company Research Group Cooperated by IEEE | en_US |
| dc.subject | Mechanical properties | en_US |
| dc.subject | Solder material | en_US |
| dc.subject | Digital image correlation | en_US |
| dc.title | Characterization of mechanical properties of solder material using digital image correlation | en_US |
| dc.type | Proceeding | en_US |
| item.cerifentitytype | Publications | - |
| item.languageiso639-1 | en | - |
| item.openairetype | Proceeding | - |
| item.fulltext | Không kèm toàn văn | - |
| item.openairecristype | http://purl.org/coar/resource_type/c_18cf | - |
| item.grantfulltext | none | - |
| Appears in Collections: | Proceedings of 2017 Joint Academic Forum on Danang | |
CORE Recommender
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.