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http://thuvienso.dut.udn.vn/handle/DUT/7333| Title: | Characterization of mechanical properties of solder material using digital image correlation | Authors: | Linh Giang, Nguyen Quang Bang, Tao |
Keywords: | Mechanical properties;Solder material;Digital image correlation | Issue Date: | 2017 | Publisher: | The University of Danang - University of Science and Technology Dut with Japan University & Company Research Group Cooperated by IEEE | URI: | http://thuvienso.dut.udn.vn/handle/DUT/7333 |
| Appears in Collections: | Proceedings of 2017 Joint Academic Forum on Danang |
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